IC Assembly/Subcon Engineer

IC Assembly/Subcon Engineer Location: Penang, Malaysia Responsibilities: • Responsible for Assembly and Test Backend Sustaining Engineering activities at all OSAT’s site. • Responsible for Assembly and Test Backend yield and performance tracking and reporting. • Develop and maintain Assembly and Test Backend-related specs and documentation. • Responsible for Assembly and Test Backend Material Review Board (MRB) and deviation management. • Drive continuous improvement program at OSAT. • Support customer audit and supplier audit at assembly partners’ site. • Collaborate with Quality Engineer on failure analysis and reliability-related activities with assembly partners. • Contribute to cross-functional activities of NPI, product qualification and product bring-up at assembly partners’ site. Qualifications: • Bachelor’s Degree in Science or Engineering discipline (Mechanical, Electronics, Physics, Chemistry, Material or related field). • Good command of English in both speaking and writing. Mandarin will be an added advantage. • Good process knowledge about IC Assembly (FOL/EOL). • Good understanding on IC packages (BGA/Flipchip /WLCSP/Leaded). • Good understanding of Failure Analysis (FA), SPC (Statistical Process Control), FMEA (Failure Mode and Effects Analysis), and JEDEC standards. • Good coordination, tracking and follow up skills on issues and projects. • Good ability to solve problems with logical approach and good analytical skills. • Ability to communicate with people at all levels, good working attitude and team player. • Willingness to travel domestically and internationally to OSAT partner sites. • 3 years of semiconductor experience is preferred for this position. • Experience/knowledge on wafer process, ATE tester 1st level debugging and statistical data analysis will be added advantage.