Packaging and Assembly Engineer

Position Overview Job Responsibilities • Develop LIDAR and 3D sensing packaging assemblies • Design optomechanical and electrical interfaces to an integrated LIDAR semiconductor chip • Specify and source suitable sub-assemblies and components • Work closely with manufacturing partners to ensure design for manufacturability and efficient transfer to production Minimum Qualifications • Minimum BS in engineering or a related field • 5+ years of relevant optoelectronic/optomechanical packaging experience • Knowledge of CAD software including Solidworks • Ability to adapt and operate under tight deadlines • Strong communication skills Preferred Qualifications • Experience of working with LIDAR systems • Experience of integrated optical device packaging • Experience of free space optical design Apply Now