Engineer / Senior Engineer Reliability (Advanced Packaging Technologies / Surface Mount Technology)
Infineon Technologies AG
Manila2026-08-26
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48 results · page 2 of 2 · dates: UTC
- 2026-08-24
AI Automation Design Packaging Lead
Advanced Micro Devices (AMD)
Austin, TexasVerificationCompilersFirmwarePhysical design2026-08-19Senior Advanced Packaging/MEMS Process Engineer
The Charles Stark Draper Laboratory, Inc.
St. Petersburg, FLSoC / ASIC2026-08-19CDI - Flip-Chip Process Development Engineer - Advanced Packaging & Photonics F/H
STMicroelectronics International N.V.
Grenoble, France2026-08-13Staff Failure Analysis Engineer - Advanced Packaging Technologies
Qualcomm Technologies, Inc.
San Diego, California, United States of AmericaSoC / ASIC2026-08-13Advanced Packaging Modeling Engineer
MIPS Tech LLC.
Malta, New York, United States of America2026-08-11Integrated Circuit - Packaging Architect Engineer
Advanced Micro Devices (AMD)
Austin, TexasFirmware2026-08-06Integrated Circuit - Packaging Architect Engineer
Advanced Micro Devices (AMD)
San Jose, CaliforniaFirmware2026-08-06Electrical Packaging Design Engineer
Advanced Micro Devices (AMD)
San Jose, CaliforniaFirmwareFPGA2026-08-03- Research & development - Eindhoven2026-07-28
Photonics Packaging Engineer
Volantis Semiconductor
Hybrid Remote/SF Bay Area/Austin/BostonRemote2026-07-25Packaging Engineer- Flip Chip
Volantis Semiconductor
Hybrid Remote/SF Bay Area/Austin/BostonRemoteSoC / ASIC2026-07-24Packaging Engineer- Materials
Volantis Semiconductor
Hybrid Remote/SF Bay Area/Austin/BostonRemoteSoC / ASIC2026-07-24Packaging Engineer- Bump Interconnect
Volantis Semiconductor
Hybrid Remote/SF Bay Area/Austin/BostonRemoteSoC / ASIC2026-07-23Advanced Packaging Engineer
Volantis Semiconductor
Hybrid Remote/SF Bay Area/Austin/BostonRemote2026-07-23Packaging Engineer
Advanced Micro Devices (AMD)
Hsinchu, TaiwanVerificationFirmwarePhysical designSoC / ASIC2026-07-10Lead Engineer, 3D Integration & Advanced Packaging
Quantum Motion
London, UK2026-06-303D IC and ADVANCED PACKAGING CAD ENGINEER
Advanced Micro Devices (AMD)
MARKHAM, CanadaRTL / HDLCompilersFirmwareSoC / ASIC2026-06-11- Taipei, Taiwan2026-05-22
- HsinChuSoC / ASIC2026-04-19
- Engineering - Leuven2026-03-09
- HsinChuSoC / ASIC2025-10-12
