Engineering roles in Belgium at 6 companies, collected from the employers' own careers pages. Every role links to the original posting.
Roles 31–60 of 192, newest first.
The Challenge Imaging spectrometers capture both spatial and spectral information for applications such as material identification, environmental monitoring, and industrial sensing. Their performance depends not only on optical filters and
The Challenge Spectral sensing captures wavelength-dependent optical information that remains inaccessible to conventional broadband imaging systems. In the short-wave infrared (SWIR) range, this capability is particularly valuable for appl
The continuous scaling of semiconductor technology is driving increasingly small feature dimensions and pitches, enabled by advanced patterning technologies such as high-NA EUV lithography. As critical dimensions (CDs) continue to shrink an
The continued scaling of semiconductor devices requires advanced characterization techniques capable of probing local electrical properties with nanoscale spatial resolution. Scanning spreading resistance microscopy (SSRM) is a unique techn
The continued scaling of semiconductor devices requires advanced characterization techniques capable of probing local electrical properties with nanoscale spatial resolution. Conventional electrical and optical characterization methods ofte
Objectives The objective of this thesis is to investigate and benchmark the use of the Xilinx Versal AI Core platform for accelerating lens-free imaging algorithms. The student will: Analyze the computational requirements of representative
What will you do? As patterning moves to high-NA EUV lithography, process windows shrink. Thinner resists produce noisier, lower-contrast SEM images, and stochastic failures (missing contacts, micro-bridges, line breaks) become a dominant y
What will you do? As semiconductor devices continue to scale with the adoption of high-NA (Numerical Aperture) Extreme Ultraviolet (EUV) lithography, defect inspection and metrology face unprecedented challenges. Identifying and measuring n
Controlled placement of nanoscale materials is a key challenge for their integration into future electronic devices. Carbon nanotubes (CNTs) are attractive channel materials for next-generation electronics, but translating their intrinsic p
As semiconductor devices continue to scale, conventional lithography faces increasing challenges in achieving the required feature dimensions and pattern fidelity. Directed self-assembly (DSA) of block copolymers offers a promising route to
Background The increasing power demand of artificial intelligence (AI) and high-performance computing (HPC) systems is driving the adoption of Integrated Voltage Regulators (IVRs) embedded directly within package substrates. By placing powe
Modern GPU power models can accurately predict total power consumption, but they often provide limited insight into the underlying physical mechanisms responsible for power dissipation. This internship aims to bridge the gap between perform
As the world around us becomes evermore technologically integrated and devices become smaller, faster, and more efficient, so too do our favourite gadgets become more complex. Inside each one of our devices exists a complicated, multi-dimen
Extreme-ultraviolet (EUV) lithography is enabling manufacturing of integrated circuits with critical dimensions of less than 20 nm for the latest technology nodes, but the high photon energy is imposing new challenges on photoresist materia
Join our research team in developing a new class of programmable-mask super-resolution lithography systems . You will develop software and optical control strategies for the generation and synchronization of computer-generated holograms (CG
CMOS scaling is entering the 3D era with complementary field-effect transistors (CFETs), in which n- and p-type devices are vertically stacked on top of eachother reducing the standard-cell footprint and improving transistor density without
The Challenge Transparent conductive oxides such as indium tin oxide (ITO) represent a highly promising material platform for nanophotonics, uniquely combining optical transparency, electrical conductivity, and tunable optical properties. T
The Challenge Programmable nanophotonic devices are emerging as a key technology for intelligent sensing in future physical AI systems. Phase-change materials (PCMs) provide a promising platform for realizing such functionality through larg
Project Description The rapid growth of Edge Artificial Intelligence (Edge AI), Internet-of-Things (IoT) devices, and data-centric computing is driving an urgent need for memory technologies that combine high performance with extremely low
The market continues to demand integrated circuits (ICs) with higher performance, greater energy efficiency, and lower cost. As conventional transistor scaling faces increasing technical and financial hurdles, the drive to deliver compellin
Background : Over the past years nanotechnology has enhanced scalability, sensitivity, and drastic cost reductions in sensing & detection of biomolecules, cells, etc. Using integrated optics, methods like Fluorescence detection and Raman sp
Context The semiconductor industry is growing rapidly, as society becomes increasingly digitalized, connected, and electrified. At the same time, continued improvements in chip performance require increasingly complex manufacturing processe
Context The semiconductor industry is growing rapidly, as society becomes increasingly digitalized, connected, and electrified. At the same time, continued improvements in chip performance require increasingly complex manufacturing processe
A multitude of new materials are being developed and investigated to enhance the performance of future generations of electronic devices. Often, complex compositions and (sub-) nanoscale dimensions are used. Therefore, analysis methods with
Join imec, one of the world’s premier research centers in nanotechnology, at its headquarters in Leuven, Belgium, to study the reliability of the most advanced high-k dielectrics. Understanding the degradation of these materials is key to g
Join imec, one of the world’s premier research centers in nanotechnology, at its headquarters in Leuven, Belgium, to study the stochastic current fluctuations within metal conductors. Understanding the link with their reliability properties
Plasma processes are widely used in semiconductor manufacturing for etching, deposition and surface modification. The ion energy and ion flux reaching the wafer strongly influence process performance, material damage and device properties.
Optimization of inline SEM Cross-Section Preparation and Inspection Scanning Electron Microscopy (SEM) is an essential metrology technique in semiconductor manufacturing, enabling high-resolution imaging of device structures and material la
Optimization of TEM Chunk Preparation Transmission Electron Microscopy (TEM) is one of the most powerful characterization techniques used in semiconductor research and manufacturing, providing detailed information on material structures and
As semiconductor devices continue to scale towards increasingly complex three-dimensional architectures, conventional blanket deposition processes face significant challenges related to material placement, process complexity, and manufactur
