Interuniversity Microelectronics Centre is an international research & development organization, active in the fields of nanoelectronics and digital technologies.
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Photonics systems deployed across different application domains require long-term operational stability. In optical communication, wavelength-division multiplexed (WDM) channels must remain precisely aligned to their designated wavelengths,
What you will do As semiconductor devices continue to scale, understanding the atomic-scale environment of dopant atoms is increasingly important for controlling activation and device performance. During this internship, you will analyze lo
Title: Machine Learning-Based Defect Classification and Anomaly Detection in Advanced IC Package 3D Interconnects Using Scanning Acoustic Microscopy Technical Description: As transistor scaling approaches its physical limits, advanced packa
Title: Physics-Based Acoustic Wave Modeling and Subsurface Warpage Reconstruction for Advanced Semiconductor Packages Technical Description: As transistor scaling approaches its physical limits, advanced packaging has become essential to dr
As the rapid expansion of artificial intelligence (AI) drives demand for higher-capacity memory solutions, the semiconductor industry is exploring novel memory architectures beyond conventional DRAM. The most promising approach is 3D-DRAM ,
Developing hardware for AI is both costly and technically demanding. The software stack evolves rapidly and is often optimized around GPUs. These realities raise a fundamental challenge: how can one validate hardware that does not yet exist
Futu re wirele ss networks are expected to provide not only communication servic es but also sensing capabilities, enabling applications such as smart factories, autonomous systems, digital twins, security monitoring, and environmental awar
The Challenge Imaging spectrometers capture both spatial and spectral information for applications such as material identification, environmental monitoring, and industrial sensing. Their performance depends not only on optical filters and
The Challenge Spectral sensing captures wavelength-dependent optical information that remains inaccessible to conventional broadband imaging systems. In the short-wave infrared (SWIR) range, this capability is particularly valuable for appl
GaN RF power amplifiers can be especially sensitive to variations in load impedance and supply variation. High voltage operating conditions lead to increased sensitivity to capacitive loading effects, and mismatch effects from the output lo
The continuous scaling of semiconductor technology is driving increasingly small feature dimensions and pitches, enabled by advanced patterning technologies such as high-NA EUV lithography. As critical dimensions (CDs) continue to shrink an
The continued scaling of semiconductor devices requires advanced characterization techniques capable of probing local electrical properties with nanoscale spatial resolution. Scanning spreading resistance microscopy (SSRM) is a unique techn
The continued scaling of semiconductor devices requires advanced characterization techniques capable of probing local electrical properties with nanoscale spatial resolution. Conventional electrical and optical characterization methods ofte
Summary The evolution of Artificial Intelligence-enabled Radio Access Networks (AI-RAN) is transforming traditional cellular base stations into distributed computing platforms that integrate real-time radio communication, network optimizati
Advanced 3D wafer stacking requires reliable bonding between increasingly diverse materials. The condition of metallic surfaces before bonding—including their chemical composition, morphology and susceptibility to oxidation—can strongly inf
Objectives The objective of this thesis is to investigate and benchmark the use of the Xilinx Versal AI Core platform for accelerating lens-free imaging algorithms. The student will: Analyze the computational requirements of representative
What will you do? As patterning moves to high-NA EUV lithography, process windows shrink. Thinner resists produce noisier, lower-contrast SEM images, and stochastic failures (missing contacts, micro-bridges, line breaks) become a dominant y
What will you do? As semiconductor devices continue to scale with the adoption of high-NA (Numerical Aperture) Extreme Ultraviolet (EUV) lithography, defect inspection and metrology face unprecedented challenges. Identifying and measuring n
Controlled placement of nanoscale materials is a key challenge for their integration into future electronic devices. Carbon nanotubes (CNTs) are attractive channel materials for next-generation electronics, but translating their intrinsic p
Test, characterization, and reporting of advanced transistor devices. The selected student will perform electrical testing and characterization of new Ge NS FET devices, analyse the results, and present the findings to the technical team to
As semiconductor devices continue to scale, conventional lithography faces increasing challenges in achieving the required feature dimensions and pattern fidelity. Directed self-assembly (DSA) of block copolymers offers a promising route to
What you will do Wireless communication based on ultrasound is attracting increasing interest for applications where traditional radio-frequency communication faces limitations. One promising approach is ultrasonic backscatter communication
Liquid-gated extended-gate Field-Effect Transistors (EGFETs) leverage the robustness and scalability of commercial CMOS technology while enabling direct interaction with (bio)chemical environments using an exposed electrode which is connect
Low-temperature solder alloys are attracting growing interest as a promising alternative to conventional SnAgCu solders used in Printed Circuit Board assembly. With melting temperatures approximately 50 °C lower, these alloys enable gentler
During this internship at imec Leuven, the student will perform the fabrication and characterization of an integrated biological nanopore-electrode electrical readout platform. This platform that we are developing builds on the so-called Ar
As advanced interconnect patterning approaches sub-20 nm dimensions, conventional evaluation methods based on yield, defects, and line resistance become increasingly insufficient to capture the true impact of process variations on circuit p
Background The increasing power demand of artificial intelligence (AI) and high-performance computing (HPC) systems is driving the adoption of Integrated Voltage Regulators (IVRs) embedded directly within package substrates. By placing powe
Modern GPU power models can accurately predict total power consumption, but they often provide limited insight into the underlying physical mechanisms responsible for power dissipation. This internship aims to bridge the gap between perform
The study of the energy loss of ions propagating in matter is crucial for advancing various fields such as ion implantation, ion beam analysis, nuclear physics, outer space exploration and radiation therapy. The rate of energy loss of an io
New materials and processes are investigated in the high-tech cleanroom of imec. The goal is to improve the performance of the future generations of processors, interconnect, and memory devices. To characterize the nanometer scale component
What you will do Biomolecule sensing is fundamental to biological research and medical diagnostics, and particularly photonic biosensors integrated with microfluidics offer a promising route toward high-throughput detection and identificati
Prussian Blue Analogues (PBAs) are a versatile family of cyanide-coordinated materials whose composition and oxidation state can be engineered to produce a wide range of electronic, ionic and magnetic properties. In particular, vanadium–chr
This internship focuses on developing and evaluating a token-efficient AI-powered knowledge hub that provides a single point of access to operational information distributed across collaboration platforms, documentation repositories, and tu
Current memory systems and hierarchies are struggling to keep pace with modern workload demands, especially those imposed by generative AI models. On-chip, SRAM scaling has stagnated due to physical scaling limits in advanced fabrication no
As the world around us becomes evermore technologically integrated and devices become smaller, faster, and more efficient, so too do our favourite gadgets become more complex. Inside each one of our devices exists a complicated, multi-dimen
Extreme-ultraviolet (EUV) lithography is enabling manufacturing of integrated circuits with critical dimensions of less than 20 nm for the latest technology nodes, but the high photon energy is imposing new challenges on photoresist materia
Modern computing platforms increasingly rely on specialized accelerators to meet the performance and energy demands of artificial intelligence and data-intensive applications. While accelerator architectures continue to improve computationa
Join our research team in developing a new class of programmable-mask super-resolution lithography systems . You will develop software and optical control strategies for the generation and synchronization of computer-generated holograms (CG
CMOS scaling is entering the 3D era with complementary field-effect transistors (CFETs), in which n- and p-type devices are vertically stacked on top of eachother reducing the standard-cell footprint and improving transistor density without
Project overview. Photoelectrochemical (PEC) water splitting is a promising route for converting sunlight directly into renewable hydrogen. Cu 2 O is a visible-light-absorbing p-type semiconductor with earth-abundant constituent elements an
Project overview. Photoelectrochemical (PEC) water splitting is a promising route for converting sunlight directly into renewable hydrogen. Antimony sulfide ( Sb 2 S 3 ) is an attractive visible-light semiconductor, but its performance as a
Adeno-associated viruses (AAVs) are pivotal delivery vectors for gene therapy due to their broad tissue tropism, low pathogenicity, and ability to support long-term gene expression. During AAV manufacturing, however, full capsids containing
The Challenge Transparent conductive oxides such as indium tin oxide (ITO) represent a highly promising material platform for nanophotonics, uniquely combining optical transparency, electrical conductivity, and tunable optical properties. T
The Challenge Programmable nanophotonic devices are emerging as a key technology for intelligent sensing in future physical AI systems. Phase-change materials (PCMs) provide a promising platform for realizing such functionality through larg
Project Description The rapid growth of Edge Artificial Intelligence (Edge AI), Internet-of-Things (IoT) devices, and data-centric computing is driving an urgent need for memory technologies that combine high performance with extremely low
The market continues to demand integrated circuits (ICs) with higher performance, greater energy efficiency, and lower cost. As conventional transistor scaling faces increasing technical and financial hurdles, the drive to deliver compellin
Background : Over the past years nanotechnology has enhanced scalability, sensitivity, and drastic cost reductions in sensing & detection of biomolecules, cells, etc. Using integrated optics, methods like Fluorescence detection and Raman sp
Context The semiconductor industry is growing rapidly, as society becomes increasingly digitalized, connected, and electrified. At the same time, continued improvements in chip performance require increasingly complex manufacturing processe
Context The semiconductor industry is growing rapidly, as society becomes increasingly digitalized, connected, and electrified. At the same time, continued improvements in chip performance require increasingly complex manufacturing processe
Op de site van imec komt de elektrische voeding via Fluvius zijnde 10,5KV HS, meerdere malen per jaar treden er spannignsdips met verschillende oorzaken (ELIA netwerk, fluvuis netwerk, onweer, ...). Als de spannigsdip diep is en/of lang is
